|
item |
Capability |
|
Layer |
1-20L |
|
Material |
FR-4,High frequency material(Ceramic、PTFE), Aluminum material |
|
Board Thickness |
0.2-5.0mm |
|
Min trace width |
0.075mm/0.075mm |
|
Copper thickness for inner and |
5OZ |
|
Tolerance of hole position accuracy |
±0.05mm |
| Aspect ratio | 16:1（孔径≥0.2mm) |
|
Min half hole size |
0.5mm |
|
Tolerance for trace |
Trace width≥0.25mm，Tolerance ±10%； Trace width<0.25mm，Tolerance±0.025mm |
|
Soldermask color |
Green/Red/Yellow/Blue/Black/White color, etc |
|
Min S/M bridge |
0.1mm |
|
Min distance between carbon |
0.4mm |
|
Finish Process
|
HASL,HALF FREE, ENIG, Flash Gold, Immersion Ag, Immersion Tin, OSP |
|
Selective Finish |
ENIG+OSP, ENIG+ Hard Gold, Full Plate Gold+ Hard Gold |
| Routing Tolerance | ±0.1mm |
|
Board thickness range for Punching PCB |
H/F material, B/T ≤0.6mm material with Halogen, B/T≤1.6mm |
|
Board Thickness |
B/T≤1.0mm ±0.1mm； B/T>1.0mm Tolerance±10%
|
|
Max working panel |
620mm×730mm |
|
Impedance control |
≤100Ω tolerance ±10%； >100Ω tolerance±5% |